发明名称 PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve the adhesive strength between a metal layer applied onto the inner surface of a through hole of a frame and a metal plated layer applied onto its surface, and to allow the light of a light emitting element to be well reflected on the inner surface of the through hole so that it is uniformly and efficiently radiated to the outside. <P>SOLUTION: A frame 2 having a through hole 2a for housing a light emitting element 3 is joined to the upper surface of a plate-like base body 1 which has a mounting part 1a for mounting the light emitting element 3 on its upper surface so that it encloses the mounting part 1a, thus constituting the package for housing a light emitting element. A metal layer 6a containing high melting point metal and metal plated layers (6b and 6c) containing cobalt are sequentially applied onto the inner surface of the through hole 2a. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004228549(A) 申请公布日期 2004.08.12
申请号 JP20030143688 申请日期 2003.05.21
申请人 KYOCERA CORP 发明人 MAEKAWA YOSHINORI
分类号 H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/56
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