| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To exhaust heat of a high heat generation high frequency circuit component efficiently, and to obtain a high frequency circuit component exhibiting high electrical stability. <P>SOLUTION: The high frequency circuit component comprises: a high frequency circuit board connected with the core of a coaxial line passing a high frequency current; a conductive substrate fixed with the high frequency circuit board; a conductive case mounting the conductive substrate and provided with a groove in the surface facing the mounting position; a member for coupling the conductive substrate to the case; and thermally conductive resin provided in the groove of the case and conducting heat generated from the high frequency circuit board to the case through the conductive substrate. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
