| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make easily manufacturable an arbitrary multilayer wiring board with a high productivity and at a low cost. <P>SOLUTION: The multilayer wiring board is provided with an interlayer insulating film 13 where a string 11 having conductivity, which is to become a via, is previously embedded in an interlayer insulating material and is integrally formed, a lower wiring layer 17 formed on one face of the interlayer insulating film 13 and an upper wiring layer which is formed on the other face of the interlayer insulating film 13 where small devices 19 to which electrodes 18 are attached are embedded and is formed of wiring 20 which is electrically connected to the layer wiring layer 17 through the string 11. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
