| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for ensuring an arranging space when an electric connection structure to the outer surface of a wafer cassette is added, and to ensure reliability and accuracy of connection without causing a cost increase in the components and production. SOLUTION: The inspection equipment 1 for a semiconductor wafer comprises wafer cassettes C, ... for holding semiconductor wafers W, ... by vacuum suction, and an inspection equipment body M incorporating an evacuating section 4 for connecting the openings 2, ... to be sucked of the contained wafer cassettes C, ... with suction openings 3, ... and performing evacuation. A vacuum connection mechanism 5 for connecting the openings 2, ... to be sucked of the wafer cassettes C, ... with the suction openings 3, ... of the evacuating section 4 is provided with electric contact parts 6a, ... for one or more systems performing electric connection at the time of mechanical connection such that they also serve as mechanical connecting parts 7a, ... of the vacuum connection mechanism 5. COPYRIGHT: (C)2004,JPO&NCIPI |
