| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is equipped with a build-up layer formed only on the surface of a core board and never or hardly warped and to provide its manufacturing method. SOLUTION: The wiring board 1 comprises the core board 2 which is formed of ceramic and provided with the front surface 4 and a rear surface 9, through-hole conductors 10 penetrating through the front surface 4 and rear surface 9 of the core board 2, core wiring layers 14 and 15 which are formed on the front surface 4 and rear surface 9 of the core board 2 respectively and connected to the through-hole conductors 10, build-up insulating layers 16 and 22 which are each formed between the core board 2 and the build-up wiring layer 24 and between the build-up wiring layers 24 and 28, and a back insulating layer 17 which contains inorganic fibers and is formed direct or through a core wiring layer 15 on the rear surface 9 (in Figure, a bottom side) of the core board 2. COPYRIGHT: (C)2004,JPO&NCIPI |
