| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents lowering of production efficiency, caused by a series of fail stops by eliminating wasteful cleaning, in the inspection of a semiconductor device which is carried out in a wafer state. SOLUTION: The semiconductor device is electrically connected to a circuit which is formed in a semiconductor substrate. It has a plurality of first conductor chips 11, each of which comprises a plurality of pads 13 formed in each of a plurality of positions, and at least one second semiconductor chip 12, which comprises a conductive pattern 14 electrically connecting a plurality of regions with each other, corresponding to the position of a plurality of pads formed in the first semiconductor chip. COPYRIGHT: (C)2004,JPO&NCIPI
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