摘要 |
A photoreactive resin composition contains (a) a powdered base metal, (b) an organic binder, (c) a photosensitive organic component, and (d) a polycarboxylic acid-based dispersing agent with a molecular weight of about 1,500 or less. Also disclosed is a method for making a circuit substrate or a ceramic multilayer substrate including the step of forming a conductive pattern using the photoreactive resin composition.
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