| 摘要 |
A manufacturing method of an electronic device having a wiring connection structure which can prevent a loose connection between a via plug and a metal wiring is obtained. In an etching process to form a via hole (8), a mixed gas of C4H8, O2 and Ar is employed as an etching gas. According to this, a surface of a side wall of the via hole (8) has a smooth shape without a microscopic unevenness on an upper part of the side wall of the via hole (8) at least. Accordingly, a gap caused by the microscopic unevenness described above does not occur between a barrier metal film (9) and the side wall of the via hole (8), and both sides stick to each other. As a result, in a cleaning process employing a hydrofluoric acid after a CMP process, a cleaning solution does not penetrate a metal film (3) through the gap between the barrier metal film (9) and the side wall of the via hole (8).
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