ANODES FOR ELECTROPLATING OPERATIONS, AND METHODS OF FORMING MATERIALS OVER SEMICONDUCTOR SUBSTRATES

摘要

The invention includes anodes for electroplating, baths. The anodes have a purity of at least 99.9%, and comprise one or more of silver, gold, nickel, chromium, copper or various solder compositions. The anodes can, for example, comprise at least 99.995% copper/phosphorus alloy, by weight; or at least 99.995% nickel and sulfur, by weight. The invention also includes methods of electroplating, materials over semiconductor substrates.