ELECTRONIC DEVICE CARRIER ADAPTED FOR TRANSMITTING HIGH FREQUENCY SIGNALS

摘要

An electronic device carrier ( 110 ) adapted for transmitting high-frequency signals, including a circuitized substrate with a plurality of conductive layers ( 240 a to 240 g) insulated from each other, the conductive layers being arranged in a sequence from a first one of the conductive layers ( 240 a) wherein a plurality of signal tracks ( 200 ) each one ending with a contact area ( 205 ) for transmitting a high-frequency signal are formed, and a reference structure ( 215 a , 215 b , 230 ) connectable to a reference voltage or ground for shielding the signal tracks the reference structure includes at least one reference track ( 230 ) formed in a second one of the conductive layers ( 240 b) adjacent to the first conductive layer and at least one further reference track formed in one of the conductive layers ( 240 d) different from the first and second conductive layer, a portion of each signal track excluding at least the area corresponding to the orthographic projection of associated contact area being superimposed in plan view to a corresponding reference track and at least a part of the area corresponding to the orthographic projection of the contact area associated to each signal track being superimposed in plan view to a corresponding further reference track with interposition of a floating conductive track, i.e. a track not connected to any signal, reference voltage or ground track.