| 摘要 |
When mounting an IC chip (1) on a circuit board (4), bumps (3) are formed on electrodes (2) on the IC chip, and the bumps and the electrodes (5) of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin (6). The resin sheet (6) is provided with through holes (15) in which are embedded conductive particles (14). The bumps (3), the through holes (15) and the electrodes are aligned. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head (8) so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together. <IMAGE> |
