发明名称 |
CHIP SCALE BALL GRID ARRAY FOR INTEGRATED CIRCUIT PACKAGE |
摘要 |
A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format. |
申请公布号 |
EP0948814(B1) |
申请公布日期 |
2004.08.11 |
申请号 |
EP19970920070 |
申请日期 |
1997.04.02 |
申请人 |
MINNESOTA MINING AND MANUFACTURING COMPANY |
发明人 |
SCHUELLER, RANDOLPH, D.;GEISSINGER, JOHN, D. |
分类号 |
H01L23/12;H01L21/60;H01L23/31;H01L23/32;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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