| 发明名称 |
Partially voided anti-pads |
| 摘要 |
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via. |
| 申请公布号 |
GB0415346(D0) |
申请公布日期 |
2004.08.11 |
| 申请号 |
GB20040015346 |
申请日期 |
2004.07.08 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. |
发明人 |
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| 分类号 |
H05K1/02;H05K1/11;H05K3/42;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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