Double layer patterning and technique for milling patterns

摘要

Double photolithography is used to produce an under-layer (130) of protective and filtering photoresist over a substrate that will have channels milled with a FIB. Secondary layers (132-140) are applied with precision on top of the first layer in order to define the precise patterns (134,140) to be milled and to provide targeting and alignment fiducials (132,136,138).