发明名称 |
Polishing head and chemical mechanical polishing apparatus including the same |
摘要 |
A polishing head and a chemical mechanical polishing apparatus having the polishing head including a plate having vacuum holes for transferring vacuum pumping force; a porous film having holes corresponding to the vacuum holes and attached to a lower surface of the plate; a retainer ring attached to the lower surface of the plate at an edge portion thereof and having a sloped surface; a clamp ring attached to the lower surface of the plate adjacent the retainer ring for clamping the retainer ring; an adjusting ring having a sloped surface parallel and in contact with the sloped surface of the retainer ring, the adjusting ring being installed between the retainer ring and the plate; and a diameter adjusting device for adjusting a diameter of the adjusting ring by moving the adjusting ring along the sloped surface of the retainer ring, thereby adjusting a height of the retainer ring. |
申请公布号 |
US6773338(B2) |
申请公布日期 |
2004.08.10 |
申请号 |
US20030357471 |
申请日期 |
2003.02.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YUN CHEOL-JU;KIM YOUNG-MIN |
分类号 |
B24B49/02;B24B37/00;B24B37/005;B24B37/04;B24B37/30;B24B37/32;B24B49/04;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B49/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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