发明名称 |
CHIP TRANSFER METHOD AND APPARATUS |
摘要 |
In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224). |
申请公布号 |
AU2003303704(A1) |
申请公布日期 |
2004.08.10 |
申请号 |
AU20030303704 |
申请日期 |
2003.12.11 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
THOMAS, M. KAMPSCHREUR;JOEP STOKKERMANS;LEON WETZELS;JOHANNES, W., D. BOSCH;WILHELMUS, J., T. DERKS;ANTONIUS, H., J. KAMPHUIS |
分类号 |
H01L21/00;H01L21/68;H05K13/04;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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