| 摘要 |
A metrology process, in accordance with the present invention, measures the dishing of a first feature made of a first material by determining the relative height of the first feature with respect to a second feature, where the first and second features have different dishing rates. The relative height of the first feature with respect to the second feature may be determined by measuring a first relative height of the first feature with respect to a reference location, measuring a second relative height of the second feature with respect to a reference location, and calculating the difference between the first and second relative heights. Alternatively, other methods may be used. The relative height is then correlated with calibration data to determine the amount of dishing of the first feature. The calibration data is generated by first providing a sample substrate with features approximately the same as the substrate to be measured, e.g., first and second calibration features of similar dishing rates as first and second features on a production substrate. The sample substrate is then processed to produce dishing of the first and second calibration features. Subsequently, the actual dishing of the first and second calibration features is measured, and the difference in dishing between the first and second calibration features calculated. The calibration data is then produced by relating the difference in dishing between the first and second calibration features to the actual dishing of the first calibration feature.
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