发明名称 |
Probe card, e.g., for testing microelectronic components, and methods for making same |
摘要 |
Various aspects of the invention provide methods of manufacturing probe cards and test systems which may test microelectronic components using such probe cards. In one specific example, a probe card may be manufactured by forming a plurality of blind holes in a substrate, with each hole having a closed bottom spaced from a back of the substrate by a back thickness. An electrically conductive metal may be deposited on the substrate to fill the holes and define an overburden on the substrate. The metal in each hole may define a conductor. At least a portion of the overburden may be removed to electrically isolate each of the conductors from one another. A portion of the substrate including the back thickness is removed to define an array of pins extending outwardly from a remaining thickness of the substrate, with each pin being an exposed length of one of the conductors.
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申请公布号 |
US6773938(B2) |
申请公布日期 |
2004.08.10 |
申请号 |
US20020230653 |
申请日期 |
2002.08.29 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
WOOD ALAN G.;DOAN TRUNG T.;HEMBREE DAVID R. |
分类号 |
G01R3/00;G01R31/28;H05K3/00;H05K3/40;H05K3/42;(IPC1-7):H01L21/66;H01L23/58;G01N27/416;H01R29/00 |
主分类号 |
G01R3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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