APPARATUS FOR ETCHING AUTOMATICALLY MICRO-REGION USING SPRAYING NOZZLE

摘要

PURPOSE: An apparatus is provided to obtain a sample for analyzing the structure of a wafer by etching exactly a micro-region of the wafer without damage using a spraying nozzle. CONSTITUTION: A wafer(23) is fixed by a wafer fixing part(24). A nozzle(21) is used for etching exactly the wafer. A controller(25) provides an etchant. The nozzle is freely moved to a desired position by the controller. The etchant is sprayed in a vaporized state through the nozzle. The controller is capable of controlling the amount of the etchant corresponding to analysis-object regions of the wafer.