CHUCK PLATE OF ASHING EQUIPMENT FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A chuck plate of ashing equipment for fabricating a semiconductor device is provided to implant easily an ashing gas of plasma state into an edge of a wafer by using a tilted angle of an inclined part. CONSTITUTION: A supporter(42) is used for supporting a bottom area of a wafer except for a polymer area. A stepped part(44) is formed from an upper side to a lower side of the supporter. An upper surface of the stepped part is opposite to an edge part of the bottom area of the wafer including the polymer area. An inclined part(46) is formed over a range of 30 to 50 degrees from an edge of the stepped part. An upper side of the inclined part is higher than the bottom area of the wafer.