发明名称 METHOD FOR BONDING SPACER OF FED PANEL
摘要 PURPOSE: A method for bonding a spacer of an FED panel is provided to prevent the damages on a metal back by bonding directly the spacer on an exposed surface of a black matrix through a patterning groove. CONSTITUTION: A black matrix(201) and a phosphor(202) are formed on an upper surface of a front plate of an anode plate. A metal back(106) is formed on each upper surface of the black matrix and the phosphor. A spacer(205) is bonded on an upper surface of the metal back by using a frit glass(204). A patterned metal back transcription metalizing film is bonded on each upper surface of the black matrix and the phosphor. The spacer is bonded on an exposed surface of the black matrix through a patterning groove(104) of the metal back transcription metalizing film by using the frit glass.
申请公布号 KR20040069533(A) 申请公布日期 2004.08.06
申请号 KR20030005957 申请日期 2003.01.29
申请人 LG ELECTRONICS INC. 发明人 SON, GWON HUI
分类号 H01J1/30;(IPC1-7):H01J1/30 主分类号 H01J1/30
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