SPACER FOR CHIP CARRIER AND FABRICATING METHOD THEREOF TO PREVENT SEMICONDUCTOR CHIP FROM BEING BROKEN

摘要

PURPOSE: A spacer for a chip carrier is provided to prevent a semiconductor chip from being broken by forming sufficient voids between the semiconductor chip on chip carriers and base material when the spacers for the chip carriers are overlapped between the chip carriers and by preventing the semiconductor chip from contacting the base material. CONSTITUTION: Chip carriers wherein semiconductor chips are formed as a predetermined disposition in a long flexible material are overlapped with each other. The spacer for the chip carrier is interposed between the overlapped chip carriers. Separately fabricated spacer protrusions(3) are formed in the surface of a flexible and long base material(2) confronting at least the chip carrier. The spacer protrusions have a protrusion quantity that forms voids between the semiconductor chip and the base material, formed at both ends of the widthwise direction of the base material and lengthwise disposed at regular intervals.