SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING THE SAME

摘要

PURPOSE: A semiconductor device and a method for packaging the same are provided to simplify a packaging process and reduce the manufacturing cost by omitting a sealing process for sealing bumps of a semiconductor chip. CONSTITUTION: A conductor pattern(220) is formed on the surface of a substrate(210). The conductor pattern is connected to a plurality of bumps. A protection layer pattern(230) is formed on the substrate and the conductor pattern. The protection layer pattern includes a hole to expose the conductive pattern and connect the bumps to the conductive pattern. An adhesive pattern(260) is formed on the protection layer pattern. The adhesive pattern includes a hole having the same pattern as the hole of the protection layer pattern.