MOUNTING OF LID OPTIMIZED FOR ELECTRONIC DEVICE CARRIER TO OPTIMIZING HEAT RADIATION AND SHIELDING OF ELECTROMAGNETIC INTERFERENCE

摘要

PURPOSE: Mounting of a lid optimized for an electronic device carrier is provided to perform effective dissipation and shield an electromagnetic interference without increasing fabricating cost. CONSTITUTION: A chip carrier has at least one grounded pad at one side. At least one semiconductor chip is coupled to the one side of the chip carrier. A conductive lid(160) is thermally coupled to the at least one semiconductor chip. At least one conductive block is electrically coupled to the at least one grounded pad and the conductive lid.