WAFER CUTTING APPARATUS AND METHOD THEREOF

摘要

PURPOSE: A wafer cutting apparatus and a method thereof are provided to cut precisely a wafer and to improve the stability of working by using a cutting unit with a laser beam generator. CONSTITUTION: A wafer cutting apparatus includes an optical microscope(1), a stage(2), a wafer cutting unit and a grip part. The wafer cutting unit(5) is located on the stage. The wafer cutting unit includes a laser beam generator and a support part. The grip part(4) is used for supporting the wafer while the wafer cutting unit cuts the wafer. The grip part applies physical pressure to the wafer.