SEMICONDUCTOR TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor treating device that can perform a uniform heat treatment on the wafers and is a vertical thermal diffusion furnace preventing metal contamination. SOLUTION: In this substrate treating device, a gas inlet port 6 through which an atmospheric gas is introduced into a core pipe 2 and a wafer boat 13 which holds wafers in the core pipe 2 are separated from each other by forming a porous partition wall 3 between the port 6 and boat 13. COPYRIGHT: (C)2004,JPO&NCIPI