发明名称 METHOD OF FORMING CIRCUIT BOARD AND CIRCUIT BOARD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a method of efficiently cheaply forming a fine circuit having a resistivity causing no problem in practice, and a circuit board formed thereby. SOLUTION: The method of forming a circuit board comprises a step of coating an insulating board with a conductive paste containing metal grains of a mean grain size of 1-100 nm, a step of irradiating a circuit forming part with a light absorbable by the metal grains, and a step of removing the conductive paste from parts not irradiated with the light. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004221146(A) 申请公布日期 2004.08.05
申请号 JP20030003819 申请日期 2003.01.10
申请人 MITSUI CHEMICALS INC 发明人 NISHIHARA KUNIO;HAYASHI TOYOJI
分类号 H05K3/02;H01L23/14;H05K3/10;(IPC1-7):H05K3/02 主分类号 H05K3/02
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