| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device capable of improving the yield of inspection using a handler. SOLUTION: A selection process using the handler is performed as follows: a QFP is mounted in a socket 3 of the handler and a test is performed; after the test, the QFP is taken out from inside the socket 3; then similar tests are performed relative to the QFP's to the number of several tens to a hundred; after the test, a cleaning chip 23 is arranged in the socket 3 and a contact pin 3b of the socket 3 is cleaned by the cleaning chip 23; and after cleaning, the QFP is mounted again in the socket 3 and the test is performed. Hereby, since the socket 3 can be cleaned automatically with proper frequency, the yield of the inspection can be improved, and since re-inspection can be reduced, the operation rate of the handler can be improved. COPYRIGHT: (C)2004,JPO&NCIPI
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