发明名称 VACUUM FORMING MOLD APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a rational piping mechanism on the assumption of mold replacement. SOLUTION: This vacuum forming mold apparatus is equipped with a mold 2 provided with a plurality of evacuation ports 1 and a piping device 3 detachable with respect to the mold 2. The piping device 3 is provided with a plurality of individual pipes 4 inserted in the respective evacuation ports 2, etc. and one piping 5 formed by collecting the individual pipes 4, etc. A heater 6 which can be brought into contact with the mold 2 in a heat conductive state is provided to the piping device 3. Further, a support device 7 capable of supporting the mold 2 is provided to the piping device 3. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004216585(A) 申请公布日期 2004.08.05
申请号 JP20030003592 申请日期 2003.01.09
申请人 ASAHI MATSUSHITA ELECTRIC WORKS LTD 发明人 IDE KOJI
分类号 B29C51/36;(IPC1-7):B29C51/36 主分类号 B29C51/36
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