| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method which gives a flexibility and a light transparency to a thin film-like chip itself. SOLUTION: The semiconductor device comprisesa semiconductor substrate 11 having semiconductor elements on the surface, and a hard film 12 covering a part or the entire side of the semiconductor substrate 11. The film has a front and back surfaces approximately flush with the front and back surfaces of the semiconductor substrate 11. The covered side of the semiconductor substrate 11 with the hard film is processed vertically or approximately vertically to the semiconductor substrate 11 surface. This is applicable to flexible wearable computers or displays having a transparency such as liquid crystal displays, etc. as a system package solution coping with the miniaturization and the portability of apparatus. Thus, a semiconductor device is provided which has a flexibility and/or light transparency and an adequately strength and realizes a high quality and high functional constitution. Accordingly, this is applicable to flexible wearable computers or displays having a transparency such as liquid crystal displays, etc. as a system package solution coping with the miniaturization and the portability of apparatus. COPYRIGHT: (C)2004,JPO&NCIPI
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