Production of structured ceramic layers on surfaces of relief arranged vertically to substrate surface comprises preparing semiconductor substrate with relief on its surface, filling the relief with lacquer and further processing

摘要

Production of structured ceramic layers on surfaces of a relief arranged vertically to a substrate surface comprises preparing a semiconductor substrate (1) with a relief on its surface, filling the relief with a lacquer (4) up to a determined depth, depositing a ceramic layer (6) made from a ceramic material using a low temperature ALD process, anisotropically etching the ceramic layer so that the ceramic layer remains on the surfaces which are vertical to the substrate surface, and removing the lacquer layer.