发明名称 |
METHOD FOR SUPPORTING SOLDER INTERCONNECTS BETWEEN COMPONENTS OF INTEGRATED CIRCUIT ASSEMBLY USING PERIMETER STOPPER |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent mechanical damages of solder interconnects between elements of an integrated circuit assembly. <P>SOLUTION: The assembly 10 comprises first circuit boards 14 and 16 and a second circuit board 18 each having a plurality of electric connection points. The electric connection points on the first circuit boards 14 and 16 are connected to the special electric connection points on the second circuit board 18 via solder structures 12 and the first circuit boards 14 and 16 and the second circuit board 18 are stacked on each other at a predetermined distance of separation H. The assembly 10 also comprises one or a plurality of stoppers 20, an insertion part 21 of each of the stoppers 20 having a predetermined height H, and the insertion part 21 is arranged between the electrical circuit boards along at least one of the perimeters of the first circuit boards 14 and 16 and the second circuit board 18. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
申请公布号 |
JP2004221581(A) |
申请公布日期 |
2004.08.05 |
申请号 |
JP20040003397 |
申请日期 |
2004.01.08 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
DAI XIANG;HUSSAIN MUMTAZ;CROMWELL STEPHEN DANIEL;LEWIS RUSSELL;NOBI LASZLO |
分类号 |
H05K3/34;H01L21/60;H01L23/12;H05K1/18;H05K3/30 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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