| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicon resin composition capable of giving a transparent cured object with high hardness, transparency and light transmissivity in a low wavelength area to be used for the protection, sealing or bonding, wavelength change and adjustment, and lens of a light emitting diode element. <P>SOLUTION: This silicon resin composition for a light emitting diode(LED) element is composed as main components of (A) organo-polysiloxane shown by a mean composition formula (1)(R<SP>1</SP>is alkenyl group, R<SP>2</SP>is monovalent hydrocarbon group excluding alkenyl group whose at least 80% is methyl group, R<SP>3</SP>is hydrogen atom or alkenyl group), (B) organo-hydrogen polysiloxane whose one molecule contains at least two SiH connection where the total amounts of SiH is 0.5 to 2.0 times as large as the total amounts of alkenyl group of the organo-polysiloxane and (C) platinum group metal system medium of the amounts of medium. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
