| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise the reliability of the evaluation test for connection of an electronic component with a mounting substrate. <P>SOLUTION: The evaluation test for predicting the condition of connecting the electronic component with the mounting substrate through a connecting conductive material uses an exclusive component 20 for evaluating the connection instead of the electronic component. The exclusive component 20 has a plurality of connecting electrodes 21 formed at the same positions of a plurality of terminal electrodes formed on the electronic component. All or part of the connecting electrodes 21 are connected to other connecting electrodes 21, respectively. The mutually connected connecting electrodes 21 are selected, corresponding to those of connecting patterns 4 of a connection party of the board 3 which are not connected to each other. A series of conduction paths from the connecting patterns 4 of the mounting board 3 to separate connecting patterns 4 of the board 3 can be formed through the exclusive component 20. Based on the test result of the conductive condition of the conductive paths, the condition of connecting the electronic component with the board 3 through the connecting conductive material is evaluated. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
