发明名称 |
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore |
摘要 |
A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.
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申请公布号 |
US2004149803(A1) |
申请公布日期 |
2004.08.05 |
申请号 |
US20040761412 |
申请日期 |
2004.01.22 |
申请人 |
IMANISHI MAKOTO;NARITA SHORIKI;IKEYA MASAHIKO;KANAYAMA SHINJI;MAE TAKAHARU |
发明人 |
IMANISHI MAKOTO;NARITA SHORIKI;IKEYA MASAHIKO;KANAYAMA SHINJI;MAE TAKAHARU |
分类号 |
H01L21/00;(IPC1-7):B23K37/04 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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