| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device mounting substrate and its manufacturing method, and a semiconductor package, which can realize high density and microfabrication compatible with narrow pitch by improving a conventional wiring substrate. SOLUTION: The semiconductor device mounting substrate is characterized as follows. A first insulating layer 14 under which a first electrode pattern 13 is embedded so as to be exposed on a surface, one or a plurality of wiring structure films 16 in which the insulating layer and a wiring layer are laminated and which has a first via, and a second electrode pattern 17 are laminated in order. The first electrode pattern 13 and the second electrode pattern 17 are conducted through the first via and the wiring layer. A surface on which the electrode pattern 13 is exposed is covered with an insulating film with open which is corresponding to the electrode pattern 13, and a base is set in close proximity of the insulating film. COPYRIGHT: (C)2004,JPO&NCIPI
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