| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the generation of solder bridges on a root part of a lead terminals 3 in mounting the semiconductor device on a printed board by soldering, and to provide an electronic apparatus provided with the semiconductor device. SOLUTION: A semiconductor element electrically connected to the lead terminals 3 is loaded on a bottom fin 1 and sealed by epoxy resin 2 to constitute the semiconductor device. The bottom fin 1 comprises a body 11 on which the semiconductor element is loaded, a first extension part 12 and a second extension part 13. The first extension part 12 is formed by extending a part of the body 11 up to the first resin end face 2a on the connection side of the lead terminals 3. The second extension part 13 is formed by extending a part of the body 11 up to the second resin end face 2b on the non-connection side of the lead terminals 3. Even when an excess soldering material enters into a space between the lead terminals 3 in mounting the semiconductor device on the printed board by soldering, the soldering material is allowed to flow into the body 11 side through the first extension part 12 and escape to the printed board side through the second extension part 13. COPYRIGHT: (C)2004,JPO&NCIPI |
