| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method with which even in the case of a recessed part having high aspect ratio, an embedded wiring composed of a sound conductive material having no defect in this recessed part can be formed and further, even in the case of intermingling fine holes and large hole on the surface of a substrate, the flatness of the plated film is improved and CMP working thereafter can be applied in a short period of time while preventing the occurrence of dishing. SOLUTION: A high resistance structure is arranged between the surface of the substrate connected with a cathode electrode and an anode electrode and while impressing a fixed voltage between the anode electrode and the cathode electrode, the interval between the substrate and the anode electrode, is filled up with the plating solution, and while controlling the current flowing between the cathode electrode and the anode electrode to the constant, the plated film is grown on the surface of the substrate. COPYRIGHT: (C)2004,JPO&NCIPI
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