发明名称 LIQUID EJECTING HEAD AND LIQUID EJECTOR
摘要 PROBLEM TO BE SOLVED: To provide a liquid ejecting head in which bonding strength is enhanced between a channel plate and a head frame. SOLUTION: The liquid ejecting head 1 provided in a liquid ejector 2 for ejecting liquid 7 comprises a channel plate 51 forming a passage 50 for supplying the liquid 7, a nozzle forming member 53 continuous to the supply passage 50 and provided with a liquid ejecting nozzle 52 formed to face a liquid compression chamber 61 being filled with the liquid 7, a heater chip 55 provided between the nozzle forming member 53 and the channel plate 51 and having a heating resistor 54 formed at a position corresponding to the liquid ejecting nozzle 52 in the liquid compression chamber 61, a head frame 58 formed contiguously to the channel plate 51 and bonded thereto through adhesive 65 filling the gap between the head frame 58 and the channel plate 51, and a substrate 56 covering the upper surface of the channel plate 51 and the head frame 58 and being connected with the heating resistor 54 wherein at least one bonding surface of the channel plate 51 and the head frame 58 is beveled. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004216601(A) 申请公布日期 2004.08.05
申请号 JP20030003754 申请日期 2003.01.09
申请人 SONY CORP 发明人 MIYAZAKI AKIHITO
分类号 B41J2/05;B41J2/16;(IPC1-7):B41J2/05 主分类号 B41J2/05
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