发明名称 |
Semiconductor device manufacturing method |
摘要 |
A polishing method comprises supplying a polishing liquid to an upper portion of a film to be polished to carry out first polishing, the film being provided on a layer having a groove with a predetermined pattern so as to be filled therewith, after the first polishing, polishing the film to carry out clean polishing while supplying one of distilled water and a cleaning liquid thereto, and after the clean polishing, polishing a residual portion of the film remaining outside of the groove by supplying a polishing liquid to carry out second polishing. |
申请公布号 |
US2004152318(A1) |
申请公布日期 |
2004.08.05 |
申请号 |
US20030730902 |
申请日期 |
2003.12.10 |
申请人 |
FUKUSHIMA DAI;MINAMIHABA GAKU;YANO HIROYUKI;TATEYAMA YOSHIKUNI |
发明人 |
FUKUSHIMA DAI;MINAMIHABA GAKU;YANO HIROYUKI;TATEYAMA YOSHIKUNI |
分类号 |
B24B37/04;H01L21/02;H01L21/304;H01L21/306;H01L21/3205;H01L21/321;H01L21/768;(IPC1-7):H01L21/44;H01L21/302;H01L21/461 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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