发明名称 COOLING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simply formed cooling device allowing reduction in size and thickness while improving cooling efficiency. <P>SOLUTION: In this cooling device, a radiator and a contact heat exchange type centrifugal pump are installed in a closed circulation passage for circulating refrigerant, the centrifugal pump is brought into contact with a heating electronic part 1 to remove heat from the heating electronic part by the heat exchange action of the refrigerant in the centrifugal pump for radiating heat from the radiator. The centrifugal pump comprises a pump casing 15 formed of a high heat conductive material and an open type impeller 11. A heat receiving surface 15b along a pump chamber 15a in the pump casing is formed in the pump casing 15 in such a shape in a contact state that is complemental to the three-dimensional shape of the upper surface of the heating electronic part 1. A suction passage 19 is installed between the heat receiving surface 15b and the inner wall surface of the pump chamber 15a. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004218941(A) 申请公布日期 2004.08.05
申请号 JP20030007168 申请日期 2003.01.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KOGA SHINYA;SAKAI TOSHISUKE;NIWATSUKINO YASUSHI;KUBOTA TOSHIYUKI
分类号 F25D9/00;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):F25D9/00 主分类号 F25D9/00
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