| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photodevice package to be mounted on an optical disk device, etc. which is formed to cope with the miniaturization and thinning of the disk device and so that the mounting surface of the photodevice is not seen from a transparent resin body. <P>SOLUTION: The package comprises a thin plate-like board 11 having an open window 12 at a center portion and IC connecting electrodes 17 disposed around the window 12, a photo IC 13 having bump electrodes 20 to be flip-chip-connected to the IC connecting electrodes 17, frames 15a, 15b disposed around the IC 13 disposed so as to locate a light receiver 14 in the window 12, and a sealing resin filled in the interior of the frames 15a, 15b and the window 12. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
