| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor chip in which a junction at a low temperature is enabled, a semiconductor mounting substrate, an electronic device having high reliability, and electronic equipment with the electronic device. <P>SOLUTION: In the method for mounting the semiconductor chip, the semiconductor chip 1 with terminals 3 formed by an electroless plating method is mounted on a wiring board 4 having a coefficient of thermal expansion different from that of the chip 1. The method has a process in which the terminals 3 for the chip 1 and the terminal 6 for the wiring board 4 are positioned so in contact through low melting-point metallic layers 7 composed of a material having the melting point lower than the component material of the terminals 3 for the chip 1, a process in which the layers 7 are melted and the corresponding terminals are joined mutually, and a process in which an opening 10 formed between at least the chip 1 and the wiring board 4 is supplied with a sealant 8. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
