| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system for electrooptically detecting a manufacture defect existing randomly in the patterned structure of a semiconductor wafer characterized by an integrated circuit die or a chip. SOLUTION: The visual field of an electrooptical camera system having a microscope lens is irradiated with optical pulses, where pulse type laser is short, and a wafer that is moving onto a focus surface assembly for optically forming the surface of a photodetector is imaged on the focus surface of an optical imaging system formed by six detector aggregates including an array of each four two-dimensional CCD matrix photodetectors. Each of the two-dimensional CCD matrix photodetectors creates a matrix electron image of two million pixels. The simultaneous creation image of a different CCD matrix detector is processed in parallel by an image processing technique. The imaging visual field is compared with another used as a reference. Difference in a corresponding pixel is detected as one showing the presence of a wafer die defect. COPYRIGHT: (C)2004,JPO&NCIPI
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