| 摘要 |
PROBLEM TO BE SOLVED: To provide a segmentation device for a tabular matter which enhances the dimensional accuracy in a divided tabular matter and enhances a production yield in a process of dividing the tabular matter. SOLUTION: A divider 10 of a wafer comprises a support plate 4a, 4b for holding a wafer 1 and a blade 5 for cleaving the wafer 1, and has a structure in which the wafer 1 can be divided by cleavage at a bilaterally symmetrical position. COPYRIGHT: (C)2004,JPO&NCIPI |
