| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in electrical connection by absorbing strain caused at the interface between a conductive paste and an insulating layer or a circuit layer so that the stress caused between fillers in the conductive paste and at the contact part between the filler and the circuit layer is reduced. <P>SOLUTION: A circuit board (1) electrically connects conductors (8) and (9) disposed on both surfaces of an insulating layer (2) with a through hole (5) formed in the insulating layer (2) in between, through a conductive paste (7) which is packed in the through hole (5) and cured. A core member (6) comprising a material whose Young's modulus is smaller than the insulating layer (2), the conductors (8) and (9), and the conductive paste (7) which has been cured, is provided in the through hole (5). <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
