| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which a multilayer connection can be certainly carried out and has a solder joint part of high reliability. SOLUTION: The multilayer wiring board is constructed so that a connecting layer, which has a wiring pattern, a conductive post formed on the wiring pattern, and a solder layer formed on a tip surface of the conductive post, and a layer to be connected, which has an interlayer connecting land with the conductive post, are connected by solder joining. There are formed a solder and an alloy composed of a metal element making up the conductive post and connecting land between the conductive post and the layer to be connected. The solder joint part, where a solder fillet is formed around the solder joint part of the conductive post, is attained. The solder joint part of high reliability is attained, and the multilayer wiring board having the solder joint part can be connected by the solder joint part having high reliability and strength, thereby, high density integration and high density mounting of electronic components using them can be made possible. COPYRIGHT: (C)2004,JPO&NCIPI |
