| 摘要 |
PROBLEM TO BE SOLVED: To make high reliability of an optical module, to miniaturize the module and to attain high integration of it. SOLUTION: The optical module includes a substrate 32 and a wiring pattern 34 formed in the substrate 32, and it includes a wiring board 30 having first and second parts 40 and 42, an optical chip 10 which has an optical part 12, which is electrically connected to the wiring pattern 34 and is mounted on the first part 40 and a substrate 70 in which inner spaces 78 and 80 are formed and which holds a lens 72 arranged in the inner space 78 by leaving an interval from the optical part. In the wiring board 30, the first and second parts 40 and 42 are two-dimensionally overlapped and a bend part 44 is included between the first and second parts 40 and 42. The bend part 44 is arranged in the inner space 80 of the substrate 70. COPYRIGHT: (C)2004,JPO&NCIPI
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