发明名称 LASER IRRADIATION METHOD, LASER IRRADIATION EQUIPMENT AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser beam irradiation method, a laser irradiation equipment to perform irradiation, and a method to manufacture a semiconductor device, which includes the processes of semiconductor film crystallization, activation, heating and the like performed by means of laser beam irradiation. SOLUTION: Using a zooming function, the time required for laser annealing can be reduced by changing the length of the above-mentioned linear beams to meet the size of a semiconductor device formed in semiconductor film, which eases restrictions on the design rule. The above-mentioned zooming function is comprised of the one which is continuous and variable and the other for which several kinds of linear beam lengths can be chosen. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004221560(A) 申请公布日期 2004.08.05
申请号 JP20030426644 申请日期 2003.12.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TANAKA KOICHIRO;YAMAZAKI SHUNPEI
分类号 G02F1/1368;G09F9/30;H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/268;G02F1/136 主分类号 G02F1/1368
代理机构 代理人
主权项
地址