发明名称 STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE IN AUXILIARY HEATER
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor device in an auxiliary heater for improving cooling effect and easily and singly replacing a controller. SOLUTION: A PTC heater 20 arranged side by side with a heater core 6 comprises a PTC heater body section 21 and a controller 25. An electrical connector section 23 arranged on the side with a fin section 22 to be heated is provided at the PTC heater body section 21. The controller 25 has a printed circuit board 24, where a plurality of power transistors 27 are assembled. A connector 26 arranged at one end of the printed circuit board 24 is fitted so that it opposes the electrical connector section 23 at the PTC heater body section 21, and a plurality of power transistors 27 arranged at the other end of a printed circuit board 24 are fitted so that they oppose the side section of the heater core 6. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004217023(A) 申请公布日期 2004.08.05
申请号 JP20030005753 申请日期 2003.01.14
申请人 DENSO CORP;DENSO AUTOMOTIVE DEUTSCHLAND GMBH 发明人 MOTOMURA HIROHISA;LAUTSCH ANDREAS;ERBER MARKUS
分类号 B60H1/22;(IPC1-7):B60H1/22 主分类号 B60H1/22
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